"Reliability evaluation of Si-dies due to assembly issues."

Falk Naumann et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.065

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type: Journal Article

metadata version: 2022-03-23

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Falk Naumann, Volkmar Gottschalk, Bernd Burchard, Frank Altmann:
Reliability evaluation of Si-dies due to assembly issues. Microelectron. Reliab. 64: 266-269 (2016)

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