"Experimental study of bump void formation according to process conditions."

Seong-Hun Na et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.12.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/NaLKPOCS13
Seong-Hun Na, Seung-Kyu Lim, Jin-Soo Kim, Hwa-Sun Park, Heung-Jae Oh, Jin-Won Choi, Su-Jeong Suh:
Experimental study of bump void formation according to process conditions. Microelectron. Reliab. 53(4): 638-644 (2013)

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