"Experimental study on the thermo-mechanical effects of underfill and ..."

Yasuyuki Morita et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.02.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto:
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device. Microelectron. Reliab. 46(5-6): 923-929 (2006)

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