"Study of aluminum thermomigration as a low thermal budget technique for ..."

B. Morillon et al. (2003)

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DOI: 10.1016/S0026-2714(03)00025-8

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type: Journal Article

metadata version: 2020-02-22

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B. Morillon, Jean-Marie Dilhac, Christian Ganibal, C. Anceau:
Study of aluminum thermomigration as a low thermal budget technique for innovative power devices. Microelectron. Reliab. 43(4): 565-569 (2003)

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