"Thermal approach of defects generation on copper/organic dielectric ..."

Lionel Dantas de Morais et al. (2007)

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DOI: 10.1016/J.MICROREL.2007.07.056

access: closed

type: Journal Article

metadata version: 2020-02-22

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Lionel Dantas de Morais, F. Allanic, F. Roqueta, J. P. Rebrasse:
Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections. Microelectron. Reliab. 47(9-11): 1614-1618 (2007)

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