"Thermal impact of extreme die thinning in bump-bonded three-dimensional ..."

Samson Melamed et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.05.030

access: closed

type: Journal Article

metadata version: 2020-02-22

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Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 79: 380-386 (2017)

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