"Reliability assessment of multi-via Cu-damascene structures by wafer-level ..."

Alessandro Marras et al. (2007)

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DOI: 10.1016/J.MICROREL.2007.07.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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Alessandro Marras, Maurizio Impronta, Ilaria De Munari, M. G. Valentini, Andrea Scorzoni:
Reliability assessment of multi-via Cu-damascene structures by wafer-level isothermal electromigration tests. Microelectron. Reliab. 47(9-11): 1492-1496 (2007)

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