"Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder."

Tingbi Luo et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.10.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao:
Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder. Microelectron. Reliab. 52(3): 585-588 (2012)

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