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"Enhanced Cu pillar design to reduce thermomechanical stress induced during ..."

Melina Lofrano et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.004

access: closed

type: Journal Article

metadata version: 2021-10-14

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Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne:
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. Microelectron. Reliab. 87: 97-105 (2018)

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