"The effect of Cu diffusion on the TDDB behavior in a low-k interlevel ..."

J. R. Lloyd et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.08.003

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type: Journal Article

metadata version: 2020-02-22

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J. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger:
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. Microelectron. Reliab. 46(9-11): 1643-1647 (2006)

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