"Effects of Cu on the interfacial reactions between Sn-8Zn-3Bi-xCu solders ..."

Lijuan Liu, Ping Wu, Wei Zhou (2014)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2013.10.001

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/LiuWZ14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LiuWZ14
Lijuan Liu, Ping Wu, Wei Zhou:
Effects of Cu on the interfacial reactions between Sn-8Zn-3Bi-xCu solders and Cu substrate. Microelectron. Reliab. 54(1): 259-264 (2014)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.