"Challenges and developments of copper wire bonding technology."

Peisheng Liu et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.12.013

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type: Journal Article

metadata version: 2025-03-03

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Peisheng Liu, Liangyu Tong, Jinlan Wang, Lei Shi, Hao Tang:
Challenges and developments of copper wire bonding technology. Microelectron. Reliab. 52(6): 1092-1098 (2012)

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