"Numerical study on the bonding tool position, tip profile and planarity ..."

D. S. Liu et al. (2003)

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DOI: 10.1016/S0026-2714(03)00095-7

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type: Journal Article

metadata version: 2020-02-22

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D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen, H. S. Liu:
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability. Microelectron. Reliab. 43(6): 935-943 (2003)

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