"Study of Al-Cu compounds as soldering bond pad for high-power device ..."

Wei Chih Liu et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.08.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wei Chih Liu, Yan Hao Chen, Te-yuan Chung, Cheng Yi Liu:
Study of Al-Cu compounds as soldering bond pad for high-power device packaging. Microelectron. Reliab. 55(12): 2549-2553 (2015)

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