"Enhanced anisotropic conductive film (ACF) void-free bonding for ..."

Yung-Sen Lin et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.06.048

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yung-Sen Lin, Jian-Zhi Xu, Shih-Wei Tien, Shih-Chan Hung, Wei-Li Yuan, Tsair-Wang Chung, Char-Ming Huang:
Enhanced anisotropic conductive film (ACF) void-free bonding for Chip-On-Glass (COG) packages by means of low temperature plasmas. Microelectron. Reliab. 52(11): 2756-2762 (2012)

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