"Failure analysis of pad-height effects in the fine-pitch interconnection ..."

Chao-Ming Lin et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.03.014

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type: Journal Article

metadata version: 2020-02-22

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Chao-Ming Lin, Tzu-Chao Lin, Te-Hua Fang, Kuo-Sheng Chao:
Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films. Microelectron. Reliab. 48(7): 1087-1092 (2008)

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