"BCB-to-oxide bonding technology for 3D integration."

S. L. Lin et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.05.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen:
BCB-to-oxide bonding technology for 3D integration. Microelectron. Reliab. 52(2): 352-355 (2012)

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