"Effects of width scaling and layout variation on dual damascene copper ..."

M. H. Lin et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.10.004

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type: Journal Article

metadata version: 2020-02-22

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M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang:
Effects of width scaling and layout variation on dual damascene copper interconnect electromigration. Microelectron. Reliab. 47(12): 2100-2108 (2007)

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