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"Fabrication and thermal analysis of flip-chip light-emitting diodes with ..."
Cheng-Chen Lin et al. (2010)
- Cheng-Chen Lin, Liann-Be Chang
, Ming-Jer Jeng
, Chia-Yi Yen, Atanu Das, Chung-Yi Tang, Ming-Yi Tsai, Mu-Jen Lai:
Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps. Microelectron. Reliab. 50(5): 683-687 (2010)
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