"Interfacial evolution and bond reliability in thermosonic Pd coated Cu ..."

Adeline B. Y. Lim et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.04.003

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type: Journal Article

metadata version: 2020-02-22

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Adeline B. Y. Lim, Chris B. Boothroyd, Oranna Yauw, Bob Chylak, Chee Lip Gan, Zhong Chen:
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. Microelectron. Reliab. 63: 214-223 (2016)

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