"Thermal evaluation of GaN-based HEMTs with various layer sizes and ..."

Zhiheng Liao et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.05.012

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type: Journal Article

metadata version: 2023-03-15

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Zhiheng Liao, Chunsheng Guo, Ju Meng, Boyang Jiang, Li Gao, Ya Su, Ruomin Wang, Shiwei Feng:
Thermal evaluation of GaN-based HEMTs with various layer sizes and structural parameters using finite-element thermal simulation. Microelectron. Reliab. 74: 52-57 (2017)

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