"Reliability challenges for copper interconnects."

Baozhen Li et al. (2004)

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DOI: 10.1016/J.MICROREL.2003.11.004

access: closed

type: Journal Article

metadata version: 2020-02-22

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Baozhen Li, Timothy D. Sullivan, Tom C. Lee, Dinesh Badami:
Reliability challenges for copper interconnects. Microelectron. Reliab. 44(3): 365-380 (2004)

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