"Failure signature analysis of power-opens in DDR3 SDRAMs."

Tan Li et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.06.104

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tan Li, Hosung Lee, GeunYong Bak, Sanghyeon Baeg:
Failure signature analysis of power-opens in DDR3 SDRAMs. Microelectron. Reliab. 88-90: 277-281 (2018)

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