"Insulated Cu wire free air ball characterization."

HungYang Leong et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.03.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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HungYang Leong, Yap Boon Kar, Navas Khan, Mohd Rusli Ibrahim, L. C. Tan:
Insulated Cu wire free air ball characterization. Microelectron. Reliab. 54(8): 1567-1574 (2014)

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