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"Effect of solder resist dissolution on the joint reliability of ENIG ..."
Hyunju Lee et al. (2018)
- Hyunju Lee, Cheolmin Kim, Cheolho Heo, Chiho Kim, Jae-Ho Lee, Yangdo Kim:
Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn-Ag-Cu solder. Microelectron. Reliab. 87: 75-80 (2018)
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