"Temporal and frequency characteristic analysis of margin-related failures ..."

Hosung Lee et al. (2017)

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DOI: 10.1016/J.MICROREL.2016.12.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hosung Lee, Sanghyeon Baeg, Nelson Hua, Shi-Jie Wen:
Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device. Microelectron. Reliab. 69: 88-99 (2017)

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