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"Finite element analysis of the effect of process-induced voids on the ..."
Van Nhat Le et al. (2016)
- Van Nhat Le
, Lahouari Benabou, Victor Etgens
, Quang Bang Tao:
Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling. Microelectron. Reliab. 65: 243-254 (2016)
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