"The impacts of high tensile stress CESL and geometry design on device ..."

Chieh-Ming Lai et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.06.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chieh-Ming Lai, Yean-Kuen Fang, Chien-Ting Lin, Chia-Wei Hsu, Wen-Kuan Yeh:
The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs. Microelectron. Reliab. 47(6): 944-952 (2007)

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