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"Experimental determination of the Young's modulus of copper and solder ..."
Frank Kraemer et al. (2018)
- Frank Kraemer, Mike Roellig, René Metasch, Joseph Al Ahmar, Karsten Meier, Steffen Wiese:
Experimental determination of the Young's modulus of copper and solder materials for electronic packaging. Microelectron. Reliab. 91: 251-256 (2018)
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