"Thermo-mechanical simulation of PCB with embedded components."

Wiyao Kpobie et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.08.016

access: closed

type: Journal Article

metadata version: 2024-10-06

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Wiyao Kpobie, Marion Martiny, Sebastien Mercier, François Lechleiter, Laurent Bodin, Aurélien Lecavelier des Etangs-Levallois, M. Brizoux:
Thermo-mechanical simulation of PCB with embedded components. Microelectron. Reliab. 65: 108-130 (2016)

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