"Impact of via density and passivation thickness on the mechanical ..."

Luka Kljucar et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.07.017

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type: Journal Article

metadata version: 2024-08-04

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Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei:
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79: 297-305 (2017)

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