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"Isothermal aging characteristics of Sn-Pb micro solder bumps."

Kyung-Seob Kim et al. (2003)

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DOI: 10.1016/S0026-2714(03)00060-X

access: closed

type: Journal Article

metadata version: 2023-08-31

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Kyung-Seob Kim, C. H. Yu, Nam-Hoon Kim, N. K. Kim, H. J. Chang, E. G. Chang:
Isothermal aging characteristics of Sn-Pb micro solder bumps. Microelectron. Reliab. 43(5): 757-763 (2003)

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