"Prediction of deformation during manufacturing processes of silicon ..."

Yeonsung Kim et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.153

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park:
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs. Microelectron. Reliab. 65: 234-242 (2016)

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