"Flip-chip packaging solution for CMOS image sensor device."

Jong-heon Kim et al. (2004)

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DOI: 10.1016/S0026-2714(03)00191-4

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jong-heon Kim, In-Soo Kang, Chi-jung Song, Young-Jik Hur, Hak-Nam Kim, Esdy Baek, Tae-Jun Seo:
Flip-chip packaging solution for CMOS image sensor device. Microelectron. Reliab. 44(1): 155-161 (2004)

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