"The effect of hygro-mechanical and thermo-mechanical stress on ..."

Dae Whan Kim, Byung-Seon Kong (2006)

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DOI: 10.1016/J.MICROREL.2005.07.119

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dae Whan Kim, Byung-Seon Kong:
The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump. Microelectron. Reliab. 46(7): 1087-1094 (2006)

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