"Material property effects on solder failure analyses."

Yeong K. Kim, Jin Hyuk Gang, Bo-Young Lee (2011)

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DOI: 10.1016/J.MICROREL.2010.12.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yeong K. Kim, Jin Hyuk Gang, Bo-Young Lee:
Material property effects on solder failure analyses. Microelectron. Reliab. 51(5): 985-993 (2011)

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