"Improved reliability of copper-cored solder joints under a harsh thermal ..."

Yunsung Kim et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.03.001

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type: Journal Article

metadata version: 2024-10-06

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Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin, Jinhan Cho, Heeman Choe:
Improved reliability of copper-cored solder joints under a harsh thermal cycling condition. Microelectron. Reliab. 52(7): 1441-1444 (2012)

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