"Investigation of electromigration reliability of redistribution lines in ..."

Chin-Li Kao et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.04.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu:
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. Microelectron. Reliab. 54(11): 2471-2478 (2014)

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