"High temperature reliability of aluminium wire-bonds to thin film, thick ..."

Rolf Johannessen, Frøydis Oldervoll, Frode Strisland (2008)

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DOI: 10.1016/J.MICROREL.2008.06.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Rolf Johannessen, Frøydis Oldervoll, Frode Strisland:
High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization. Microelectron. Reliab. 48(10): 1711-1719 (2008)

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