"Measurement and analysis of thermal stresses in 3D integrated structures ..."

Tengfei Jiang et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.05.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Rui Huang, Paul S. Ho:
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias. Microelectron. Reliab. 53(1): 53-62 (2013)

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