"Recent advances of nanolead-free solder material for low processing ..."

Hongjin Jiang, Kyoung-sik Moon, C. P. Wong (2013)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2013.04.005

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/JiangMW13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/JiangMW13
Hongjin Jiang, Kyoung-sik Moon, C. P. Wong:
Recent advances of nanolead-free solder material for low processing temperature interconnect applications. Microelectron. Reliab. 53(12): 1968-1978 (2013)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.