"A numerical failure analysis on lead breakage issues of ultra fine pitch ..."

Changsoo Jang et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.06.013

access: closed

type: Journal Article

metadata version: 2020-02-22

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Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang:
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process. Microelectron. Reliab. 46(2-4): 487-495 (2006)

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