"Lifetime prediction modeling of non-insulated TO-220AB packages with ..."

Sébastien Jacques et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.08.017

access: closed

type: Journal Article

metadata version: 2021-10-14

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Sébastien Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier:
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. Microelectron. Reliab. 52(1): 212-216 (2012)

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