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"Improving the FE simulation of molded packages using warpage measurements."
Saskia Huber et al. (2014)
- Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang:
Improving the FE simulation of molded packages using warpage measurements. Microelectron. Reliab. 54(9-10): 1862-1866 (2014)
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