"Using Taguchi method to obtain the optimal design of heat dissipation ..."

De-Shau Huang et al. (2016)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2016.07.006

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/HuangTZTWL16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/HuangTZTWL16
De-Shau Huang, Wen-Bin Tu, Xiu-Ming Zhang, Liang-Te Tsai, Ti-Yuan Wu, Ming-Tzer Lin:
Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging. Microelectron. Reliab. 65: 131-141 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.