"Electromigration of Cu/low dielectric constant interconnects."

Chao-Kun Hu, Lynne M. Gignac, R. Rosenberg (2006)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2005.05.015

access: closed

type: Journal Article

metadata version: 2023-09-11

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/HuGR06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/HuGR06
Chao-Kun Hu, Lynne M. Gignac, R. Rosenberg:
Electromigration of Cu/low dielectric constant interconnects. Microelectron. Reliab. 46(2-4): 213-231 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.