"Quantitative reliability analysis of flip-chip packages under ..."

Yao Hsu, Chih-Yen Su, Wen-Fang Wu (2011)

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DOI: 10.1016/J.MICROREL.2011.04.019

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yao Hsu, Chih-Yen Su, Wen-Fang Wu:
Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties. Microelectron. Reliab. 51(12): 2284-2289 (2011)

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