"Direct gold and copper wires bonding on copper."

Hong Meng Ho et al. (2003)

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DOI: 10.1016/S0026-2714(03)00074-X

access: closed

type: Journal Article

metadata version: 2022-04-09

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Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath, Eric Beyne:
Direct gold and copper wires bonding on copper. Microelectron. Reliab. 43(6): 913-923 (2003)

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