"Reliability aspects of copper metallization and interconnect technology ..."

Frank Hille et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.119

access: closed

type: Journal Article

metadata version: 2020-02-22

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Frank Hille, Roman Roth, Carsten Schäffer, Holger Schulze, Nicolas Heuck, Daniel Bolowski, Karsten Guth, Alexander Ciliox, Karina Rott, Frank Umbach, Martin Kerber:
Reliability aspects of copper metallization and interconnect technology for power devices. Microelectron. Reliab. 64: 393-402 (2016)

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