"Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball ..."

Chunjing Hang et al. (2008)

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DOI: 10.1016/J.MICROREL.2007.06.008

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type: Journal Article

metadata version: 2024-02-03

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Chunjing Hang, Chunqing Wang, M. Mayer, Yanhong Tian, Norman Y. Zhou, Honghui Wang:
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectron. Reliab. 48(3): 416-424 (2008)

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